loading

Share to:
sharethis sharing button

Quartz Heat dissipation substrate/slot component

The highly reliable quartz heat dissipation base plate and heat dissipation trough, specially designed for laser beam combiners, are the core supporting components to solve the "overheating and inaccuracy" pain point of high-power beam combiners, helping your beam combination products maintain stable performance even under long-term high-load operation.
 
No matter you are manufacturing industrial fiber lasers, semiconductor laser modules, medical lasers, or scientific research laser equipment, this heat dissipation substrate can be perfectly adapted to cover almost all laser processing scenarios such as laser marking, welding, cutting, and cleaning, ensuring that your entire machine has fewer malfunctions and a longer lifespan under high-power conditions
Availability:
  • Finewin wafers

Product Description

Introduction of materials

The quartz heat dissipation base plate and heat dissipation trough of our laser beam combator are all made of high-purity fused quartz ‌ with a purity of ‌SiO₂ ≥99.99% as the core base material.
This material is made from carefully selected gangue quartz as raw material, which is melted at a temperature above 1800℃ and then rapidly cooled and solidified. It completely avoids the problems of many impurities and poor thermal stability of common quartz materials. Its coefficient of thermal expansion is less than 1/20 of that of common metals. It hardly deforms within a wide temperature range of -40℃ to 800℃. At the same time, it has extremely low laser body absorption characteristics, fundamentally avoiding the risk of local heating under high-power laser irradiation. It is an ideal base material that takes into account both optical compatibility and heat dissipation performance in laser beam combination scenarios.

Physical parameter

Item

data

Material

Quartz

20°C Density (g/cm3)

2.2

Softening point(°C)

1670

Annealing point(°C)

1210

Deformation point(°C)

1110

Heat conductivity (W/m·K)

1.4

Coefficient of thermal expansion

0.55e-6/K

Advantages

1. It has extremely small thermal expansion, minimal fiber positioning offset when the temperature changes, and good optical path stability at low power.

2. Deep ultraviolet has better light transmission, and quartz is preferred for ultraviolet pump beam combination.

3. The slotting, polishing and drilling processes are mature and cost-effective, making it suitable for batch use of civilian and medium and small power lasers.

Who need them:

1.The total combined beam power is less than 300W, and it can operate continuously.
2. Ultraviolet band beam combination, lithography, and low-power light sources for scientific research;
3. Pursue low cost and large-scale mass production;
4. It has very little light leakage and no obvious thermal load.

Previous: 
Next: