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Typical Specifications
Basic materials characteristics
item | data |
Density | (@ 25°C/77°F) 2.23 g/cm3 |
Refractive Index (nd) | 1.472 |
Linear Thermal Coefficient of Expansionα | (20-300°C/ 68-572°F) 3.25 x 10-6/K |
Transformation Temperature | Tg 530°C/986°F |
Annealing Point (1013 dPa·s) | 560°C/1040°F |
Softening Point(107.6 dPa·s) | 815°C /1508°F |
The possible applications
Semiconductor applications
Micro lithography
Substrates for anodic bonding
Optical substrates
Micro system technology
Micro mechanics
Microstructure applications
